Eurasia Packaging Fair Technical Trip



On Wednesday dated October 20, 2021 a technical trip was held at the Tuyap Fair and Congress Center Büyükçekmece Istanbul within the scope of the “Computer-Aided Cardboard Packaging Design I and Printing Techniques” course.


Our Packaging Fair technical trip took place with the 2nd year students of Printing and Publishing Technologies Program.


Sales Director of Böttcher Turkey – Böttcher Matbaa Malzemeleri Tic. Ltd. Şti Serdar ÖZER provided our students with information about the rollers used in printing machines and Böttcher, the German company, and introduce the sector and the materials used in the sector to the students.


Hubergroup Türkiye Tic. Ltd. Rıdvan Pişkin who works as a marketing representative in the German company, that produces printing paints allowed them to get to know the sector providing the students with the necessary information about the printing paints and the company.


The students saw the works on metal tin offset printing technique and packaging with Lecturer Gamze ŞENTÜRK.


After consultation with industry representatives, the necessary contact information was provided to our students about job placement after graduation.